This e-book is aimed toward senior undergraduates, graduate scholars and researchers attracted to quantitative realizing and modeling of nanomaterial and equipment physics. With the speedy slow-down of semiconductor scaling that drove info expertise for many years, there's a urgent have to comprehend and version electron circulate at its primary molecular limits.
By Yan Li,Deepak Goyal
This quantity presents a accomplished reference for graduate scholars and execs in either academia and at the basics, processing information, and purposes of 3D microelectronic packaging, an pattern for destiny microelectronic applications. Chapters written via specialists hide the latest learn effects and growth within the following parts: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, complicated fabrics, warmth dissipation, thermal administration, thermal mechanical modeling, caliber, reliability, fault isolation, and failure research of 3D microelectronic applications. various photos, tables, and didactic schematics are integrated all through. This crucial quantity equips readers with an in-depth realizing of all elements of 3D packaging, together with packaging structure, processing, thermal mechanical and moisture comparable reliability matters, universal mess ups, constructing components, and destiny demanding situations, offering insights into key parts for destiny examine and development.
- The Cutting Edge of Tribology :A Decade of Progress in Friction, Lubrication and Wear
- New Perspectives on Mineral Nucleation and Growth: From Solution Precursors to Solid Materials
- Physical Models of Semiconductor Quantum Devices
- Modelling and Mechanics of Carbon-based Nanostructured Materials (Micro and Nano Technologies)
- Nanostructured Materials Preparation via Condensation Ways
Additional resources for 3D Microelectronic Packaging: From Fundamentals to Applications (Springer Series in Advanced Microelectronics)
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